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Home-Accessories- Computer maintenance - TG-G15-02
Thermal silicone compound (grease) for heatsinksHelps the heat dissipation from a CPU, chipset or processor to a heatsinkExcellent thermal impedancePerfect stability - will not separate, run, migrate, or bleedNon capacitive or electrically conductive
Net weight: 15 g (23 g in the bottle)Dimensions: 30 (diameter) x 35 mmColor: greyThermal conductivity: > 4.63 W / mKThermal Impedance <0.0087 ° C-in2 / WWeight loss after 96 hours @ 100 °C: <0.15 %Permittivity @ 106 Hz: 2.4Volume Resistivity: 5.0 x 10E13 (Ohm*cm)Dielectric Strength: 2.5 KV/mmOperating Temperature: -30 ~ 280 ° CDensity: > 3.15 g/ cm3 Volatility: <0.15 % @100 ° The dielectric constant: > 2.4Dissipation Factor: <0.005Viscosity: 12500 Pa sThixotropic index: 350 ± 10 1/10mmComposites: 15% silicone compoundsCompounds: 35% of carbonThe compounds of metal oxides: 50%
CE Certificate (pdf file)
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